平行论坛1：化合物半导体关键材料 Parallel Forum 1: Critical Materials of Compound Semiconductors | |
时间：2024年4月10日 09:00-18:00 & 11日 09:00-12:00 Time: Time: April 10, 2024 09:00-18:00 & April 11, 2024 09:00-12:00 地点：中国武汉光谷科技会展中心 • 三层 • 多功能厅3 Location: China Optics Valley Convention & Exhibition Center • 3rd Floor • Multi-Function Hall 3 | |
4月10日 / April 10 | |
09:00-09:25 | 大尺寸碳化硅衬底材料技术及产业进展 Technology and Industrial Progress of Large Size Silicon Carbide Substrate Materials 刘春俊——北京天科合达半导体股份有限公司首席技术官 LIU Chunjun——CTO of TankeBlue Co,. Ltd |
09:25-09:50 | 国产光刻胶的关键技术及多元化产业链 Key Technologies and Diversified Industry Chain of Domestic Photoresist 李 冰——北京科华微电子材料有限公司总经理 LI Bing——General Manager of Kempur Microelectronics Inc. |
09:50-10:15 | CMP材料技术发展及产业化现状 Technology and industrialization status of CMP materials 王 磊——湖北鼎汇微电子材料有限公司总经理 WANG Lei——General Manager of Dinghui Microelectronics |
10:15-10:40 | 助力化合物半导体之下一代先进光刻技术 The Next Generation Advanced Lithography Technology Promoting the Development of Compound Semiconductors 向诗力——九峰山实验室光刻研发负责人 XIANG Shili——Head of Photolithography Research at JFS Lab |
10:40-10:55 | 茶歇 / Coffee Break |
10:55-11:20 | 宽禁带半导体单片集成和集成电路 Wide bandgap monolithic integration and ICs 李晓航——沙特阿卜杜拉国王科技大学副教授 LI Xiaohang——Associate Professor of King Abdullah University of Science & Technology |
11:20-11:45 | 高纯半导体材料技术进展及应用展望 Progress and Application Prospects of High Purity Semiconductor Materials Technology 卢鹏荐——武汉拓材科技有限公司董事长兼总经理 LU Pengjian——Chairman & General Manager of Wuhan Tuocai Technology co.,Ltd |
11:45-12:10 | 先进键合集成技术与应用 Advanced bonding integration technology and its applications 母凤文——北京青禾晶元半导体科技有限责任公司董事长 MU Fengwen——Chairman of Isabers Materials |
12:10-13:30 | 午餐 / Lunch |
13:30-13:55 | 国产光刻胶的关键技术及进展 Key Technologies and Progress of Domestic Photoresist 杜光宇——徐州博康信息化学品有限公司博康光刻胶事业部总经理 DU Guangyu——Photoresist BD General Manager of Xuzhou B&C Chemical Co.,Ltd |
13:55-14:20 | 宽禁带半导体氧化镓晶体生长与缺陷研究 Growth and defect study of wide bandgap semiconductor gallium oxide crystals 陶绪堂——山东大学讲席教授 TAO Xutang——Endowed Chair Professor of Shandong University |
14:20-14:45 | 超宽禁带氧化镓半导体功率器件及光电探测器研究进展 Research Progress in Ultra-Wide Bandgap Semiconductor Gallium Oxide-Based Power Devices and Photodetectors 龙世兵——中国科学技术大学微电子学院执行院长、教授 LONG Shibing——Professor & Executive Dean of School of Micro-electronics, University of Science and Technology of China |
14:45-15:10 | p型NiO赋能Ga2O3双极型电导和雪崩能力 p-NiO empowers Ga2O3 bipolar conduction and avalanche capability 叶建东——南京大学电子科学与工程学院教授 YE Jiandong——Professor of School of Electronic Science and Engineering, Nanjing University |
15:10-15:35 | 金刚石半导体衬底的发展 The Development of Diamond Semiconductor Substrates 王宏兴——西安交通大学教授 WANG Hongxing——Professor of Xi`an Jiaotong University |
15:35-16:00 | 氧化镓SBD界面缺陷分析 Interface defects in gallium oxide SBD 魏强民——九峰山实验室宽禁带材料研究首席专家 WEI Qiangmin——Chief Expert of Wide-band Gap Material at JFS Lab |
16:00-16:15 | 茶歇 / Coffee Break |
16:15-16:40 | 宽禁带氧化物半导体SnO2的紫外光探测器与p型掺杂研究 Investigation of the UV Photodetector and P-type Doping for Wide Bandgap Oxide SnO2 黎明锴——湖北大学材料科学与工程学院教授 LI Mingkai——Professor of School of Materials Science and Engineering, Hubei University |
16:40-17:05 | 宽禁带半导体辐射探测器研究 Research on wide bandgap semiconductor radiation detectors 梁红伟——大连理工大学集成电路学院院长、教授 LIANG Hongwei——Professor & Dean of Integrated Circuits School, Dalian University of Technology |
17:05-17:30 | 超宽禁带半导体氧化镓射频及功率器件 Ultra wide bandgap semiconductor RF and power devices for Ga2O3 周 弘——西安电子科技大学微电子学院教授 ZHOU Hong——Professor of School of Microelectronics, Xidian University |
17:30-17:55 | 宽禁带半导体界面工程及其电子器件应用 Interface Engineering of Wide Bandgap Semiconductors and Its Applications in Electronic Devices 张召富——武汉大学教授 ZHANG Zhaofu——Professor of Wuhan University |
17:55-18:20 | 精细石墨——半导体材料制造之柱 Fine Graphite, a pillar for semiconductor material manufacture 吴厚政——赛迈科先进材料股份有限公司首席技术官 WU Houzheng——CTO of SIAMC Advanced Material Corporation |
4月11日 / April 11 | |
09:00-09:25 | 化合物半导体异质集成热物性检测技术 Thermophysical Characterization Technology for Heterogeneously Integrated Compound Semiconductors 袁超——武汉大学研究员 YUAN Chao——Professor of Wuhan University |
09:25-09:50 | 半导体材料中热电子动力学 Hot Carrier Dynamics in Semiconductor Materials 汪林望——北京龙讯旷腾科技有限公司创始人兼首席科学家 WANG Linwang——Founder & Chief Scientist of Longxun Quantum |
09:50-10:15 | 研磨抛光工艺在第四代半导体材料的应用 Precision Lapping & Polishing process for WBG 刘思齐——北京艾姆希半导体科技有限公司总经理 LIU Siqi——General Manager of MCF |
10:15-10:40 | 光电器件及集成技術中蚀刻及剥离製程应用 Application of Etching and Stripping Processes in Optoelectronic Devices and Integrated Technologies 许朱男——苏州博洋化学股份有限公司研发总监 XU Zhunan——Research & Development Director of Boyang Chemical |
10:40-10:55 | 茶歇 / Coffee Break |
10:55-11:20 | SiC衬底磨抛新材料，助力衬底厂降本增效 Providing grinding and polishing new materials for SiC crystals, empowering substrate manufacturers to reduce costs and increase efficiency 陈 斌——深圳中机新材料有限公司董事长 CHEN Bin——Chairman of Shenzhen ZhongJi MicroMaterial Co.,Ltd |
11:20-11:45 | 纳米铈基稀土抛光材料及其在半导体抛光中的应用进展 Nano-ceria based polishing slurries and their application in semiconductor CMP 杨娟玉——有研稀土新材料股份有限公司稀土分离与化合物事业部总经理 YANG Juanyu——General Manager of Rare Earth Separation and Compounds Division, Grirem Advanced Materials CO., Ltd. |
11:45-14:00 | 午餐 / Lunch |
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